"Cold" Corrugated--Application of Ultrasonic Technology to Tile Line (5)

Two major discoveries from the use of unheated corrugating roller tests. One is that if we do not humidify the core paper, it is impossible to achieve a successful bonding effect by relying solely on continuous action ultrasonic bonding techniques. In the very short contact time between the ultrasonic contact and the tip of the tip, the natural moisture content of the base paper is between {5%-8%) insufficient to activate the paste adhesion on the surface of the paper (see Table 9). The second major discovery is that the required adhesive strength can only be obtained by humidifying the corrugating medium, but as the production speed increases, the bond strength will be greatly reduced. This point can be very evident from the peel test and adhesion strength test (see Table 9 and Table 10). (Figure 10 uses ultrasonic technology) Even though the production speed is low, the adhesive strength varies widely (see Table 10). This is due to the low frequency of vibration caused by the ultrasonic contact itself. These regular low-frequency vibrations interfere with the ultrasonic vibration transmitted from the ultrasonic contacts. This will cause periodic vibration between the ultrasonic contact and the corrugating roller, which will affect the quality of the bond. If the production speed exceeds 10 meters/minute, the adhesive strength will be reduced. This is due to the fact that the production speed is too fast and shortens the exposure time of the paper under ultrasound. Reduced contact time between paper and ultrasonic waves will reduce the vibration effect (see Figure 12). At a production speed of 10 m/min, the exposure time for each tip was 0.005 seconds, and at a production speed of 200 m/minute, the exposure time was 0.0003 seconds. In the static pressure test, it has been concluded that the exposure time is greater than 0.06 seconds to obtain a satisfactory bond strength. (Fig. 12 Improves processor performance by increasing the energy consumption of the vibratory board at the speed of the board to improve the performance of the processor) (To be continued)